Analysis of the production of ATLAS indium bonded pixel modules

Articolo
Data di Pubblicazione:
2006
Citazione:
Analysis of the production of ATLAS indium bonded pixel modules / G. Alimonti, A. Andreazza, A. Bulgheroni, G. Corda, S. Di Gioia, A. Fiorello, C. Gemme, M. Koziel, F. Manca, C. Meroni, P. Nechaeva, A. Paoloni, L. Rossi, A. Rovani, E. Ruscino. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - 565:1(2006 Sep 01), pp. 296-302. [10.1016/j.nima.2006.05.048]
Abstract:
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The prodn. is half-way through at the time of this writing. This paper also discusses the problems encountered during prodn. and the adopted solns.
Tipologia IRIS:
01 - Articolo su periodico
Keywords:
Indium bump; Pixel detector; Stripping
Elenco autori:
G. Alimonti, A. Andreazza, A. Bulgheroni, G. Corda, S. Di Gioia, A. Fiorello, C. Gemme, M. Koziel, F. Manca, C. Meroni, P. Nechaeva, A. Paoloni, L. Rossi, A. Rovani, E. Ruscino
Autori di Ateneo:
ANDREAZZA ATTILIO ( autore )
MERONI CHIARA ( autore )
Link alla scheda completa:
https://air.unimi.it/handle/2434/25356

Aree Di Ricerca

Settori


Settore FIS/04 - Fisica Nucleare e Subnucleare