Data di Pubblicazione:
1997
Citazione:
Dual-Block Assembled Microelectronics Tactile Sensor / A. Gandelli, M. Lazzaroni, R. Ottoboni - In: Proceedings of the society of photo-optical instrumentation engineers (SPIE)[s.l] : IMPAS, 1997 Oct. - pp. 203-208 (( convegno International Symposium on Microelectronics tenutosi a Philadelphia nel 1997.
Abstract:
A recent evolution of MCM sensors, for robotics applications led to introduce a dual - block design for tactile sensors. This solution allow an optimization of the design by reducing the system complexity and improving the final performance of the system. The proposed arrangement does not need any specific calibration during the production process and provides an automatic cancellation of noises introduce by charge amplifiers, even. when system device. The complexity in using devices is so greatly reduced.
Tipologia IRIS:
03 - Contributo in volume
Keywords:
hybrid microelectronics; tactile sensors; MCM; analog processing
Elenco autori:
A. Gandelli, M. Lazzaroni, R. Ottoboni
Link alla scheda completa:
Titolo del libro:
Proceedings of the society of photo-optical instrumentation engineers (SPIE)