An approach to computer simulation of bonding and package crosstalk in mixed-signal CMOS ICs
Contributo in Atti di convegno
Data di Pubblicazione:
2004
Citazione:
An approach to computer simulation of bonding and package crosstalk in mixed-signal CMOS ICs / G. Trucco, G. Boselli, V. Liberali - In: SBCCI 2004 : 17. symposium on integrated circuits and systems design : Porto de Galinhas, Pernambuco, Brazil, september 7-11, 2004 : proceedings / [a cura di] [s.n.]. - New York : Association for computing machinery, 2004. - ISBN 1581139470. - pp. 129-134 (( convegno Symposium on Integrated Circuits and Systems Design (SBCCI) nel 2004.
Abstract:
This paper presents an approach for simulation of mixed analog-digital CMOS integrated circuits, aiming at estimating crosstalk effects due to current pulses drawn from voltage supplies. A simple expression of voltage and current in the pull-up and the pull-down of a CMOS logic gate is derived, and a representation of digital switching noise in time domain can be easily calculated through a dedicated computer program. This representation is used to perform an analog simulation using SPICE, to evaluate the propagation of the switching noise through the parasitic elements of the package and of the bonding wires. Simulation results for two case studies are presented.
Tipologia IRIS:
03 - Contributo in volume
Keywords:
Crosstalk; Mixed-signal ICs
Elenco autori:
G. Trucco, G. Boselli, V. Liberali
Link alla scheda completa:
Titolo del libro:
SBCCI 2004 : 17. symposium on integrated circuits and systems design : Porto de Galinhas, Pernambuco, Brazil, september 7-11, 2004 : proceedings