Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology
Contributo in Atti di convegno
Data di Pubblicazione:
2019
Citazione:
Effects of the On-Die Decoupling Capacitors on the EME Performance in 28 nm FD-SOI Technology / M. Rotigni, M. Merlo, A. Sanna, P. Colombo, R. Castellan, V. Liberali, A. Barletta, R. Dechecchi, K.S. Skytte - In: 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)[s.l] : IEEE, 2019. - ISBN 978-1-7281-4263-0. - pp. 78-80 (( Intervento presentato al 12. convegno EMC tenutosi a Hangzhou nel 2019 [10.1109/EMCCompo.2019.8919707].
Abstract:
A dedicated test chip has been designed in order to support the study of the EMC performance, and more specifically the Conducted Emission, of a microcontroller family in M28 FDSOI technology. The focus in designing the test chip has been put on the on-die decoupling capacitors, in particular on the topology of the placement as well as the capacitance amount.
Tipologia IRIS:
03 - Contributo in volume
Keywords:
150 measurement method; automotive microcontrollers; bonding wires; conducted emissions; EMI simulation; IEC 61967-4; IR-drop analysis; package
Elenco autori:
M. Rotigni, M. Merlo, A. Sanna, P. Colombo, R. Castellan, V. Liberali, A. Barletta, R. Dechecchi, K.S. Skytte
Link alla scheda completa:
Titolo del libro:
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)